M38510/31901BFA
vs
M38510/31901BFA
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Active
Obsolete
Ihs Manufacturer
LANSDALE SEMICONDUCTOR INC
MOTOROLA INC
Part Package Code
DFP
DFP
Package Description
DFP, FL16,.3
DFP,
Pin Count
16
16
Reach Compliance Code
compliant
unknown
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.71
8542.32.00.71
JESD-30 Code
R-CDFP-F16
R-CDFP-F16
JESD-609 Code
e0
e0
Memory Density
16 bit
16 bit
Memory IC Type
MEMORY CIRCUIT
MEMORY CIRCUIT
Memory Width
4
4
Number of Functions
1
1
Number of Terminals
16
16
Number of Words
4 words
4 words
Number of Words Code
4
4
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-55 °C
Organization
4X4
4X4
Package Body Material
CERAMIC, METAL-SEALED COFIRED
CERAMIC, METAL-SEALED COFIRED
Package Code
DFP
DFP
Package Equivalence Code
FL16,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
FLATPACK
FLATPACK
Qualification Status
Qualified
Not Qualified
Screening Level
MIL-PRF-38535 Class B
MIL-PRF-38535 Class B
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
MILITARY
MILITARY
Terminal Finish
TIN LEAD
TIN LEAD
Terminal Form
FLAT
FLAT
Terminal Pitch
1.27 mm
Terminal Position
DUAL
DUAL
Base Number Matches
1
1
Rohs Code
Compare M38510/31901BFA with alternatives
Compare M38510/31901BFA with alternatives