M38510/31001BCX
vs
HD74LS11P-E
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
MOTOROLA INC
RENESAS ELECTRONICS CORP
Part Package Code
DIP
DIP
Package Description
DIP,
DIP, DIP14,.3
Pin Count
14
14
Reach Compliance Code
unknown
compliant
HTS Code
8542.39.00.01
8542.39.00.01
Family
LS
LS
JESD-30 Code
R-GDIP-T14
R-PDIP-T14
Logic IC Type
AND GATE
AND GATE
Number of Functions
3
3
Number of Inputs
3
3
Number of Terminals
14
14
Operating Temperature-Max
125 °C
75 °C
Operating Temperature-Min
-55 °C
-20 °C
Package Body Material
CERAMIC, GLASS-SEALED
PLASTIC/EPOXY
Package Code
DIP
DIP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Propagation Delay (tpd)
30 ns
20 ns
Qualification Status
Not Qualified
Not Qualified
Supply Voltage-Max (Vsup)
5.5 V
5.25 V
Supply Voltage-Min (Vsup)
4.5 V
4.75 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
TTL
TTL
Temperature Grade
MILITARY
COMMERCIAL EXTENDED
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Position
DUAL
DUAL
Base Number Matches
4
1
Pbfree Code
Rohs Code
Length
19.2 mm
Load Capacitance (CL)
15 pF
Max I(ol)
0.008 A
Moisture Sensitivity Level
1
Package Equivalence Code
DIP14,.3
Power Supply Current-Max (ICC)
6.6 mA
Prop. Delay@Nom-Sup
20 ns
Schmitt Trigger
NO
Seated Height-Max
5.06 mm
Terminal Pitch
2.54 mm
Width
7.62 mm
Compare M38510/31001BCX with alternatives
Compare HD74LS11P-E with alternatives