HD74LS11P-E
vs
SN74LS11JD
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
RENESAS ELECTRONICS CORP
MOTOROLA SEMICONDUCTOR PRODUCTS
Part Package Code
DIP
Package Description
DIP, DIP14,.3
DIP, DIP14,.3
Pin Count
14
Reach Compliance Code
compliant
unknown
HTS Code
8542.39.00.01
Family
LS
JESD-30 Code
R-PDIP-T14
R-XDIP-T14
Length
19.2 mm
Load Capacitance (CL)
15 pF
Logic IC Type
AND GATE
AND GATE
Max I(ol)
0.008 A
Moisture Sensitivity Level
1
Number of Functions
3
Number of Inputs
3
Number of Terminals
14
14
Operating Temperature-Max
75 °C
70 °C
Operating Temperature-Min
-20 °C
Package Body Material
PLASTIC/EPOXY
CERAMIC
Package Code
DIP
DIP
Package Equivalence Code
DIP14,.3
DIP14,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Power Supply Current-Max (ICC)
6.6 mA
Prop. Delay@Nom-Sup
20 ns
Propagation Delay (tpd)
20 ns
Qualification Status
Not Qualified
Schmitt Trigger
NO
NO
Seated Height-Max
5.06 mm
Supply Voltage-Max (Vsup)
5.25 V
Supply Voltage-Min (Vsup)
4.75 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
TTL
TTL
Temperature Grade
COMMERCIAL EXTENDED
COMMERCIAL
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Width
7.62 mm
Base Number Matches
1
3
JESD-609 Code
e0
Power Supplies
5 V
Terminal Finish
Tin/Lead (Sn/Pb)
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