M38510/30909BFX
vs
54LS298M/B2AJC
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
NATIONAL SEMICONDUCTOR CORP
MOTOROLA INC
Part Package Code
DFP
QLCC
Package Description
DFP,
QCCN,
Pin Count
16
20
Reach Compliance Code
unknown
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Family
LS
LS
JESD-30 Code
R-GDFP-F16
S-CQCC-N20
Logic IC Type
D FLIP-FLOP
MULTIPLEXER
Number of Bits
4
Number of Functions
1
1
Number of Terminals
16
20
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-55 °C
Output Polarity
TRUE
Package Body Material
CERAMIC, GLASS-SEALED
CERAMIC, METAL-SEALED COFIRED
Package Code
DFP
QCCN
Package Equivalence Code
FL16,.3
Package Shape
RECTANGULAR
SQUARE
Package Style
FLATPACK
CHIP CARRIER
Propagation Delay (tpd)
48 ns
Qualification Status
Not Qualified
Not Qualified
Screening Level
MIL-PRF-38535 Class B
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
YES
Technology
TTL
TTL
Temperature Grade
MILITARY
MILITARY
Terminal Form
FLAT
NO LEAD
Terminal Position
DUAL
QUAD
Trigger Type
NEGATIVE EDGE
Base Number Matches
6
3
Rohs Code
Additional Feature
FOUR 2:1 MUX FOLLOWED BY REGISTER
JESD-609 Code
e0
Length
8.885 mm
Load Capacitance (CL)
50 pF
Power Supply Current-Max (ICC)
21 mA
Seated Height-Max
1.9 mm
Terminal Finish
TIN LEAD
Terminal Pitch
1.27 mm
Width
8.885 mm
Compare M38510/30909BFX with alternatives
Compare 54LS298M/B2AJC with alternatives