M38510/30902BFX
vs
GD54HCT158D
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
NXP SEMICONDUCTORS
GOLDSTAR ELECTRON CO LTD
Part Package Code
DFP
Package Description
DFP,
,
Pin Count
16
Reach Compliance Code
unknown
unknown
HTS Code
8542.39.00.01
Family
LS
HCT
JESD-30 Code
R-GDFP-F16
R-PDSO-G16
Logic IC Type
MULTIPLEXER
MULTIPLEXER
Number of Functions
2
4
Number of Inputs
4
2
Number of Outputs
1
1
Number of Terminals
16
16
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-55 °C
Output Polarity
TRUE
INVERTED
Package Body Material
CERAMIC, GLASS-SEALED
PLASTIC/EPOXY
Package Code
DFP
SOP
Package Equivalence Code
FL16,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
FLATPACK
SMALL OUTLINE
Propagation Delay (tpd)
65 ns
53 ns
Qualification Status
Not Qualified
Not Qualified
Screening Level
MIL-PRF-38535 Class B
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
YES
Technology
TTL
CMOS
Temperature Grade
MILITARY
MILITARY
Terminal Form
FLAT
GULL WING
Terminal Position
DUAL
DUAL
Base Number Matches
1
1
Load Capacitance (CL)
50 pF
Compare M38510/30902BFX with alternatives
Compare GD54HCT158D with alternatives