M38510/30902BFX
vs
TC74HC258AF-EL
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Active
Active
Ihs Manufacturer
LANSDALE SEMICONDUCTOR INC
TOSHIBA CORP
Part Package Code
DFP
SOIC
Package Description
DFP,
SOP,
Pin Count
16
16
Reach Compliance Code
compliant
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Family
LS
HC/UH
JESD-30 Code
R-GDFP-F16
R-PDSO-G16
Logic IC Type
MULTIPLEXER
MULTIPLEXER
Number of Functions
2
4
Number of Inputs
4
2
Number of Outputs
1
1
Number of Terminals
16
16
Operating Temperature-Max
125 °C
85 °C
Operating Temperature-Min
-55 °C
-40 °C
Output Polarity
TRUE
INVERTED
Package Body Material
CERAMIC, GLASS-SEALED
PLASTIC/EPOXY
Package Code
DFP
SOP
Package Equivalence Code
FL16,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
FLATPACK
SMALL OUTLINE
Propagation Delay (tpd)
65 ns
25 ns
Qualification Status
Not Qualified
Not Qualified
Supply Voltage-Max (Vsup)
5.5 V
6 V
Supply Voltage-Min (Vsup)
4.5 V
2 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
YES
Technology
TTL
CMOS
Temperature Grade
MILITARY
INDUSTRIAL
Terminal Form
FLAT
GULL WING
Terminal Position
DUAL
DUAL
Base Number Matches
11
1
Pbfree Code
Rohs Code
JESD-609 Code
e0
Length
10.3 mm
Load Capacitance (CL)
50 pF
Output Characteristics
3-STATE
Seated Height-Max
1.9 mm
Terminal Finish
TIN LEAD
Terminal Pitch
1.27 mm
Width
5.3 mm
Compare M38510/30902BFX with alternatives
Compare TC74HC258AF-EL with alternatives