M38510/30609BEA
vs
8001701EX
feature comparison
All Stats
Differences Only
Rohs Code
No
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
MOTOROLA SEMICONDUCTOR PRODUCTS
MOTOROLA INC
Package Description
DIP, DIP16,.3
DIP,
Reach Compliance Code
unknown
unknown
JESD-30 Code
R-XDIP-T16
R-GDIP-T16
JESD-609 Code
e0
Max Frequency@Nom-Sup
22000000 Hz
Number of Bits
8
8
Number of Functions
1
1
Number of Terminals
16
16
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-55 °C
Package Body Material
CERAMIC
CERAMIC, GLASS-SEALED
Package Code
DIP
DIP
Package Equivalence Code
DIP16,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Power Supplies
5 V
Qualification Status
Not Qualified
Not Qualified
Screening Level
38535Q/M;38534H;883B
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
TTL
TTL
Temperature Grade
MILITARY
MILITARY
Terminal Finish
Tin/Lead (Sn/Pb)
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Base Number Matches
5
4
HTS Code
8542.39.00.01
Additional Feature
CLOCK INHIBIT
Count Direction
RIGHT
Family
LS
Length
19.3 mm
Logic IC Type
PARALLEL IN SERIAL OUT
Output Polarity
TRUE
Propagation Delay (tpd)
46 ns
Seated Height-Max
4.19 mm
Supply Voltage-Max (Vsup)
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
Trigger Type
POSITIVE EDGE
Width
7.62 mm
fmax-Min
22 MHz
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