M38510/30107BEX
vs
74HCT273D,653
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
MOTOROLA INC
NXP SEMICONDUCTORS
Package Description
DIP,
7.50 MM, PLASTIC, MS-013, SOT-163-1, SOP-20
Reach Compliance Code
unknown
compliant
HTS Code
8542.39.00.01
8542.39.00.01
Family
LS
HCT
JESD-30 Code
R-GDIP-T16
R-PDSO-G20
Logic IC Type
D FLIP-FLOP
D FLIP-FLOP
Number of Bits
1
8
Number of Functions
4
1
Number of Terminals
16
20
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-40 °C
Output Polarity
COMPLEMENTARY
TRUE
Package Body Material
CERAMIC, GLASS-SEALED
PLASTIC/EPOXY
Package Code
DIP
SOP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
SMALL OUTLINE
Propagation Delay (tpd)
55 ns
45 ns
Qualification Status
Not Qualified
Not Qualified
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
YES
Technology
TTL
CMOS
Temperature Grade
MILITARY
AUTOMOTIVE
Terminal Form
THROUGH-HOLE
GULL WING
Terminal Position
DUAL
DUAL
Trigger Type
POSITIVE EDGE
POSITIVE EDGE
fmax-Min
25 MHz
20 MHz
Base Number Matches
8
2
Rohs Code
Part Package Code
SOP
Pin Count
20
Manufacturer Package Code
SOT163-1
Factory Lead Time
4 Weeks
JESD-609 Code
e4
Length
12.8 mm
Load Capacitance (CL)
50 pF
Max Frequency@Nom-Sup
20000000 Hz
Max I(ol)
0.004 A
Moisture Sensitivity Level
1
Package Equivalence Code
SOP20,.4
Packing Method
TR
Peak Reflow Temperature (Cel)
260
Seated Height-Max
2.65 mm
Terminal Finish
Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Pitch
1.27 mm
Time@Peak Reflow Temperature-Max (s)
30
Width
7.5 mm
Compare M38510/30107BEX with alternatives
Compare 74HCT273D,653 with alternatives