74HCT273D,653
vs
TC74HCT273AFW-ELP
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Active
Ihs Manufacturer
NXP SEMICONDUCTORS
TOSHIBA CORP
Part Package Code
SOP
SOIC
Package Description
7.50 MM, PLASTIC, MS-013, SOT-163-1, SOP-20
0.300 INCH, PLASTIC, SOIC-20
Pin Count
20
20
Manufacturer Package Code
SOT163-1
Reach Compliance Code
compliant
unknown
HTS Code
8542.39.00.01
Factory Lead Time
4 Weeks
Family
HCT
HCT
JESD-30 Code
R-PDSO-G20
R-PDSO-G20
JESD-609 Code
e4
Length
12.8 mm
12.8 mm
Load Capacitance (CL)
50 pF
50 pF
Logic IC Type
D FLIP-FLOP
D FLIP-FLOP
Max Frequency@Nom-Sup
20000000 Hz
Max I(ol)
0.004 A
Moisture Sensitivity Level
1
Number of Bits
8
8
Number of Functions
1
1
Number of Terminals
20
20
Operating Temperature-Max
125 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Output Polarity
TRUE
TRUE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
SOP
SOP
Package Equivalence Code
SOP20,.4
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE
SMALL OUTLINE
Packing Method
TR
Peak Reflow Temperature (Cel)
260
240
Propagation Delay (tpd)
45 ns
38 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
2.65 mm
2.7 mm
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
AUTOMOTIVE
INDUSTRIAL
Terminal Finish
Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form
GULL WING
GULL WING
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
30
NOT SPECIFIED
Trigger Type
POSITIVE EDGE
POSITIVE EDGE
Width
7.5 mm
7.5 mm
fmax-Min
20 MHz
24 MHz
Base Number Matches
2
1
Pbfree Code
Compare 74HCT273D,653 with alternatives
Compare TC74HCT273AFW-ELP with alternatives