M38510/21004BJA vs 27HC291-55I/SP feature comparison

M38510/21004BJA QP Semiconductor

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27HC291-55I/SP Microchip Technology Inc

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Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer QP SEMICONDUCTOR INC MICROCHIP TECHNOLOGY INC
Part Package Code DIP DIP
Package Description DIP, 0.300 INCH, SKINNY, PLASTIC, DIP-24
Pin Count 24 24
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.71 8542.32.00.71
Access Time-Max 55 ns 55 ns
JESD-30 Code R-XDIP-T24 R-PDIP-T24
JESD-609 Code e0 e0
Memory Density 16384 bit 16384 bit
Memory IC Type OTP ROM OTP ROM
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 24 24
Number of Words 2048 words 2048 words
Number of Words Code 2000 2000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -55 °C -40 °C
Organization 2KX8 2KX8
Package Body Material UNSPECIFIED PLASTIC/EPOXY
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Screening Level MIL-M-38510 Class B
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology BIPOLAR CMOS
Temperature Grade MILITARY INDUSTRIAL
Terminal Finish TIN LEAD TIN LEAD
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Position DUAL DUAL
Base Number Matches 4 1
Pbfree Code No
Rohs Code No
I/O Type COMMON
Length 34.67 mm
Output Characteristics 3-STATE
Package Equivalence Code DIP24,.3
Programming Voltage 12.75 V
Seated Height-Max 4.06 mm
Standby Current-Max 0.04 A
Supply Current-Max 0.086 mA
Terminal Pitch 2.54 mm
Width 7.62 mm

Compare M38510/21004BJA with alternatives

Compare 27HC291-55I/SP with alternatives