27HC291-55I/SP vs N82S191ANB feature comparison

27HC291-55I/SP Microchip Technology Inc

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N82S191ANB NXP Semiconductors

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Pbfree Code No
Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer MICROCHIP TECHNOLOGY INC SIGNETICS CORP
Part Package Code DIP
Package Description 0.300 INCH, SKINNY, PLASTIC, DIP-24 DIP, DIP24,.6
Pin Count 24
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.71 8542.32.00.71
Access Time-Max 55 ns 55 ns
I/O Type COMMON
JESD-30 Code R-PDIP-T24 R-PDIP-T24
JESD-609 Code e0 e0
Length 34.67 mm
Memory Density 16384 bit 16384 bit
Memory IC Type OTP ROM OTP ROM
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 24 24
Number of Words 2048 words 2048 words
Number of Words Code 2000 2000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 85 °C 75 °C
Operating Temperature-Min -40 °C
Organization 2KX8 2KX8
Output Characteristics 3-STATE 3-STATE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP DIP
Package Equivalence Code DIP24,.3 DIP24,.6
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Parallel/Serial PARALLEL PARALLEL
Programming Voltage 12.75 V
Qualification Status Not Qualified Not Qualified
Seated Height-Max 4.06 mm
Standby Current-Max 0.04 A
Supply Current-Max 0.086 mA 0.175 mA
Supply Voltage-Max (Vsup) 5.5 V 5.25 V
Supply Voltage-Min (Vsup) 4.5 V 4.75 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS BIPOLAR
Temperature Grade INDUSTRIAL COMMERCIAL EXTENDED
Terminal Finish TIN LEAD Tin/Lead (Sn/Pb)
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Width 7.62 mm
Base Number Matches 1 3

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Compare N82S191ANB with alternatives