M38510/20902BYX
vs
63S841AW
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Active
Ihs Manufacturer
LANSDALE SEMICONDUCTOR INC
Part Package Code
DFP
Package Description
FP-18
Pin Count
18
Reach Compliance Code
compliant
ECCN Code
EAR99
HTS Code
8542.32.00.71
Access Time-Max
20 ns
JESD-30 Code
R-XDFP-F18
Memory Density
16384 bit
Memory IC Type
OTP ROM
Memory Width
8
Number of Functions
1
Number of Terminals
18
Number of Words
2048 words
Number of Words Code
2000
Operating Mode
SYNCHRONOUS
Operating Temperature-Max
125 °C
Operating Temperature-Min
-55 °C
Organization
2KX8
Package Body Material
UNSPECIFIED
Package Code
DFP
Package Shape
RECTANGULAR
Package Style
FLATPACK
Parallel/Serial
PARALLEL
Qualification Status
Not Qualified
Supply Voltage-Max (Vsup)
5.25 V
Supply Voltage-Min (Vsup)
4.75 V
Supply Voltage-Nom (Vsup)
5 V
Surface Mount
YES
Technology
BIPOLAR
Temperature Grade
MILITARY
Terminal Form
FLAT
Terminal Position
DUAL
Base Number Matches
1
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