M38510/20703BFX
vs
53S081F
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Ihs Manufacturer
QP SEMICONDUCTOR INC
Part Package Code
DFP
Package Description
0.25 X 0.375 INCH, FP-16
Pin Count
16
Reach Compliance Code
unknown
ECCN Code
EAR99
HTS Code
8542.32.00.71
Access Time-Max
55 ns
JESD-30 Code
R-XDFP-F16
Memory Density
32768 bit
Memory IC Type
OTP ROM
Memory Width
8
Number of Functions
1
Number of Terminals
16
Number of Words
32 words
Number of Words Code
4000
Operating Mode
ASYNCHRONOUS
Operating Temperature-Max
125 °C
Operating Temperature-Min
-55 °C
Organization
4KX8
Package Body Material
UNSPECIFIED
Package Code
DFP
Package Shape
RECTANGULAR
Package Style
FLATPACK
Parallel/Serial
PARALLEL
Qualification Status
Not Qualified
Supply Current-Max
0.13 mA
Supply Voltage-Nom (Vsup)
5 V
Surface Mount
YES
Technology
BIPOLAR
Temperature Grade
MILITARY
Terminal Form
FLAT
Terminal Position
DUAL
Base Number Matches
4
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