M38510/20404BEX vs HM1-7620-2 feature comparison

M38510/20404BEX NXP Semiconductors

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HM1-7620-2 Intersil Corporation

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS INTERSIL CORP
Part Package Code DIP
Package Description DIP,
Pin Count 16
Reach Compliance Code unknown not_compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.71 8542.32.00.71
Access Time-Max 35 ns 85 ns
JESD-30 Code R-XDIP-T16 R-XDIP-T16
Memory Density 16384 bit 16384 bit
Memory IC Type OTP ROM OTP ROM
Memory Width 4 4
Number of Functions 1 1
Number of Terminals 16 16
Number of Words 512 words 512 words
Number of Words Code 4000 4000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Organization 4KX4 4KX4
Package Body Material UNSPECIFIED CERAMIC
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Supply Current-Max 0.165 mA 0.13 mA
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology BIPOLAR TTL
Temperature Grade MILITARY MILITARY
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Position DUAL DUAL
Base Number Matches 4 2
Rohs Code No
JESD-609 Code e0
Package Equivalence Code DIP16,.3
Terminal Finish Tin/Lead (Sn/Pb)
Terminal Pitch 2.54 mm

Compare M38510/20404BEX with alternatives

Compare HM1-7620-2 with alternatives