M38510/20303BEX vs M38510/20304BEX feature comparison

M38510/20303BEX Teledyne e2v

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M38510/20304BEX NXP Semiconductors

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Part Life Cycle Code Active Obsolete
Ihs Manufacturer TELEDYNE E2V (UK) LTD NXP SEMICONDUCTORS
Part Package Code DIP DIP
Package Description DIP, DIP,
Pin Count 16 16
Reach Compliance Code compliant unknown
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.71 8542.32.00.71
Access Time-Max 25 ns 55 ns
JESD-30 Code R-XDIP-T16 R-XDIP-T16
Memory Density 256 bit 4096 bit
Memory IC Type OTP ROM OTP ROM
Memory Width 8 4
Number of Functions 1 1
Number of Terminals 16 16
Number of Words 256 words 256 words
Number of Words Code 32 1000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Organization 32X8 1KX4
Package Body Material UNSPECIFIED UNSPECIFIED
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Supply Voltage-Max (Vsup) 5.25 V
Supply Voltage-Min (Vsup) 4.75 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology BIPOLAR BIPOLAR
Temperature Grade MILITARY MILITARY
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Position DUAL DUAL
Base Number Matches 4 4
Screening Level MIL-M-38510 Class B
Supply Current-Max 0.13 mA

Compare M38510/20303BEX with alternatives

Compare M38510/20304BEX with alternatives