M38510/20302BEA vs TBP24S10MJ feature comparison

M38510/20302BEA Lansdale Semiconductor Inc

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TBP24S10MJ Texas Instruments

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer LANSDALE SEMICONDUCTOR INC TEXAS INSTRUMENTS INC
Part Package Code DIP DIP
Package Description 0.25 X 0.875 INCH, DIP-16 DIP, DIP16,.3
Pin Count 16 16
Reach Compliance Code compliant not_compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.71 8542.32.00.71
Access Time-Max 75 ns 75 ns
JESD-30 Code R-XDIP-T16 R-GDIP-T16
JESD-609 Code e0
Memory Density 1024 bit 1024 bit
Memory IC Type OTP ROM OTP ROM
Memory Width 4 4
Number of Functions 1 1
Number of Terminals 16 16
Number of Words 256 words 256 words
Number of Words Code 256 256
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Organization 256X4 256X4
Package Body Material UNSPECIFIED CERAMIC, GLASS-SEALED
Package Code DIP DIP
Package Equivalence Code DIP16,.3 DIP16,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Screening Level MIL-M-38510 Class B
Supply Current-Max 0.13 mA 0.1 mA
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology BIPOLAR BIPOLAR
Temperature Grade MILITARY MILITARY
Terminal Finish TIN LEAD
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Base Number Matches 1 1
Rohs Code No
Length 19.56 mm
Peak Reflow Temperature (Cel) NOT SPECIFIED
Seated Height-Max 5.08 mm
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 7.62 mm

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Compare TBP24S10MJ with alternatives