M38510/06102BFA
vs
MC10H186FN
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Active
Obsolete
Ihs Manufacturer
SRI INTERNATIONAL
MOTOROLA SEMICONDUCTOR PRODUCTS
Part Package Code
DFP
Package Description
DFP, FL16,.3
QCCJ, LDCC20,.4SQ
Pin Count
16
Reach Compliance Code
unknown
unknown
HTS Code
8542.39.00.01
Category CO2 Kg
12
12
Compliance Temperature Grade
Military: -55C to +125C
Qualifications
DLA
Family
10K
JESD-30 Code
R-GDFP-F16
S-PQCC-J20
JESD-609 Code
e0
e0
Logic IC Type
D FLIP-FLOP
D FLIP-FLOP
Max Frequency@Nom-Sup
200000000 Hz
250000000 Hz
Number of Bits
1
Number of Functions
2
6
Number of Terminals
16
20
Operating Temperature-Max
125 °C
70 °C
Operating Temperature-Min
-55 °C
Output Polarity
COMPLEMENTARY
Package Body Material
CERAMIC, GLASS-SEALED
PLASTIC/EPOXY
Package Code
DFP
QCCJ
Package Equivalence Code
FL16,.3
LDCC20,.4SQ
Package Shape
RECTANGULAR
SQUARE
Package Style
FLATPACK
CHIP CARRIER
Power Supply Current-Max (ICC)
72 mA
121 mA
Propagation Delay (tpd)
3.9 ns
Qualification Status
Qualified
Not Qualified
Screening Level
MIL-PRF-38535 Class B
Surface Mount
YES
YES
Technology
ECL
ECL
Temperature Grade
MILITARY
COMMERCIAL
Terminal Finish
TIN LEAD
Tin/Lead (Sn/Pb)
Terminal Form
FLAT
J BEND
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
DUAL
QUAD
Trigger Type
POSITIVE EDGE
MASTER-SLAVE
fmax-Min
200 MHz
Base Number Matches
7
5
Rohs Code
kg CO2e/kg
12
Average Weight (mg)
825.5
CO2e (mg)
9906
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