M38510/06102BEX vs 10173FC feature comparison

M38510/06102BEX SRI International Sarnoff

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10173FC Fairchild Semiconductor Corporation

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Part Life Cycle Code Active Obsolete
Ihs Manufacturer SRI INTERNATIONAL FAIRCHILD SEMICONDUCTOR CORP
Part Package Code DIP DFP
Package Description DIP, DFP,
Pin Count 16 16
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Family 10K 10K
JESD-30 Code R-GDIP-T16 R-CDFP-F16
Logic IC Type D FLIP-FLOP D LATCH
Number of Bits 1 4
Number of Functions 2 1
Number of Terminals 16 16
Operating Temperature-Max 125 °C 75 °C
Operating Temperature-Min -55 °C
Output Polarity COMPLEMENTARY TRUE
Package Body Material CERAMIC, GLASS-SEALED CERAMIC, METAL-SEALED COFIRED
Package Code DIP DFP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE FLATPACK
Propagation Delay (tpd) 3.9 ns
Qualification Status Not Qualified Not Qualified
Surface Mount NO YES
Technology ECL ECL
Temperature Grade MILITARY COMMERCIAL EXTENDED
Terminal Form THROUGH-HOLE FLAT
Terminal Position DUAL DUAL
Trigger Type POSITIVE EDGE LOW LEVEL
fmax-Min 200 MHz
Base Number Matches 1 2
Additional Feature FOUR 2:1 MUX FOLLOWED BY LATCH
Length 9.906 mm
Output Characteristics OPEN-EMITTER
Package Equivalence Code FL16,.3
Power Supply Current-Max (ICC) 66 mA
Seated Height-Max 1.905 mm
Terminal Pitch 1.27 mm
Width 6.731 mm

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