M378T3354BG0-LE6 vs HYS64T32900EU-3-B2 feature comparison

M378T3354BG0-LE6 Samsung Semiconductor

Buy Now Datasheet

HYS64T32900EU-3-B2 Qimonda AG

Buy Now Datasheet
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer SAMSUNG SEMICONDUCTOR INC QIMONDA AG
Part Package Code DIMM DIMM
Package Description DIMM, DIMM, DIMM240,40
Pin Count 240 240
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.36 8542.32.00.36
Access Mode FOUR BANK PAGE BURST SINGLE BANK PAGE BURST
Access Time-Max 0.45 ns 0.45 ns
Additional Feature AUTO/SELF REFRESH AUTO/SELF REFRESH
JESD-30 Code R-XDMA-N240 R-XDMA-N240
Memory Density 2147483648 bit 2147483648 bit
Memory IC Type DDR DRAM MODULE DDR DRAM MODULE
Memory Width 64 64
Number of Functions 1 1
Number of Ports 1 1
Number of Terminals 240 240
Number of Words 33554432 words 33554432 words
Number of Words Code 32000000 32000000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Organization 32MX64 32MX64
Package Body Material UNSPECIFIED UNSPECIFIED
Package Code DIMM DIMM
Package Shape RECTANGULAR RECTANGULAR
Package Style MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY
Qualification Status Not Qualified Not Qualified
Self Refresh YES YES
Supply Voltage-Max (Vsup) 1.9 V 1.9 V
Supply Voltage-Min (Vsup) 1.7 V 1.7 V
Supply Voltage-Nom (Vsup) 1.8 V 1.8 V
Surface Mount NO NO
Technology CMOS CMOS
Terminal Form NO LEAD NO LEAD
Terminal Position DUAL DUAL
Base Number Matches 1 1
Rohs Code Yes
Clock Frequency-Max (fCLK) 333 MHz
I/O Type COMMON
Operating Temperature-Max 65 °C
Operating Temperature-Min
Output Characteristics 3-STATE
Package Equivalence Code DIMM240,40
Peak Reflow Temperature (Cel) NOT SPECIFIED
Refresh Cycles 8192
Supply Current-Max 1.08 mA
Temperature Grade COMMERCIAL
Terminal Pitch 1 mm
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED

Compare M378T3354BG0-LE6 with alternatives

Compare HYS64T32900EU-3-B2 with alternatives