M378T3253FF3-CE600
vs
M378T3253FG0-CE600
feature comparison
| Pbfree Code |
Yes
|
Yes
|
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Contact Manufacturer
|
Obsolete
|
| Ihs Manufacturer |
SAMSUNG SEMICONDUCTOR INC
|
SAMSUNG SEMICONDUCTOR INC
|
| Package Description |
DIMM, DIMM240,40
|
DIMM, DIMM240,40
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.32.00.36
|
8542.32.00.36
|
| Access Time-Max |
0.45 ns
|
0.45 ns
|
| Clock Frequency-Max (fCLK) |
333 MHz
|
333 MHz
|
| I/O Type |
COMMON
|
COMMON
|
| JESD-30 Code |
R-PDMA-N240
|
R-PDMA-N240
|
| JESD-609 Code |
e3
|
e3
|
| Memory Density |
2147483648 bit
|
2147483648 bit
|
| Memory IC Type |
DDR DRAM MODULE
|
DDR DRAM MODULE
|
| Memory Width |
64
|
64
|
| Moisture Sensitivity Level |
1
|
1
|
| Number of Terminals |
240
|
240
|
| Number of Words |
33554432 words
|
33554432 words
|
| Number of Words Code |
32000000
|
32000000
|
| Operating Temperature-Max |
95 °C
|
95 °C
|
| Operating Temperature-Min |
|
|
| Organization |
32MX64
|
32MX64
|
| Output Characteristics |
3-STATE
|
3-STATE
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
DIMM
|
DIMM
|
| Package Equivalence Code |
DIMM240,40
|
DIMM240,40
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
MICROELECTRONIC ASSEMBLY
|
MICROELECTRONIC ASSEMBLY
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Refresh Cycles |
8192
|
8192
|
| Supply Current-Max |
2.12 mA
|
2.12 mA
|
| Supply Voltage-Nom (Vsup) |
1.8 V
|
1.8 V
|
| Surface Mount |
NO
|
NO
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
OTHER
|
OTHER
|
| Terminal Finish |
MATTE TIN
|
MATTE TIN
|
| Terminal Form |
NO LEAD
|
NO LEAD
|
| Terminal Pitch |
1 mm
|
1 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Base Number Matches |
1
|
1
|
|
|
|
Compare M378T3253FF3-CE600 with alternatives
Compare M378T3253FG0-CE600 with alternatives