M377S3323CT0-C1H
vs
MT18LSDT3272G-10CXX
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Active
Ihs Manufacturer
SAMSUNG SEMICONDUCTOR INC
MICRON TECHNOLOGY INC
Part Package Code
DIMM
Package Description
DIMM, DIMM168
,
Pin Count
168
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.36
8542.32.00.36
Access Mode
FOUR BANK PAGE BURST
FOUR BANK PAGE BURST
Access Time-Max
6 ns
6 ns
Additional Feature
AUTO/SELF REFRESH
AUTO/SELF REFRESH
Clock Frequency-Max (fCLK)
100 MHz
I/O Type
COMMON
JESD-30 Code
R-XDMA-N168
R-XDMA-N168
Memory Density
2415919104 bit
2415919104 bit
Memory IC Type
SYNCHRONOUS DRAM MODULE
SYNCHRONOUS DRAM MODULE
Memory Width
72
72
Moisture Sensitivity Level
1
Number of Functions
1
1
Number of Ports
1
1
Number of Terminals
168
168
Number of Words
33554432 words
33554432 words
Number of Words Code
32000000
32000000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Organization
32MX72
32MX72
Output Characteristics
3-STATE
Package Body Material
UNSPECIFIED
UNSPECIFIED
Package Code
DIMM
Package Equivalence Code
DIMM168
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
MICROELECTRONIC ASSEMBLY
MICROELECTRONIC ASSEMBLY
Qualification Status
Not Qualified
Not Qualified
Refresh Cycles
4096
Self Refresh
YES
YES
Standby Current-Max
0.02 A
Supply Current-Max
2.66 mA
Supply Voltage-Max (Vsup)
3.6 V
3.6 V
Supply Voltage-Min (Vsup)
3 V
3 V
Supply Voltage-Nom (Vsup)
3.3 V
3.3 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Form
NO LEAD
NO LEAD
Terminal Pitch
1.27 mm
Terminal Position
DUAL
DUAL
Base Number Matches
1
1
Pbfree Code
Peak Reflow Temperature (Cel)
235
Time@Peak Reflow Temperature-Max (s)
30
Compare M377S3323CT0-C1H with alternatives
Compare MT18LSDT3272G-10CXX with alternatives