MT18LSDT3272G-10CXX
vs
M374S3323BT0-C1H
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Active
Obsolete
Ihs Manufacturer
MICRON TECHNOLOGY INC
SAMSUNG SEMICONDUCTOR INC
Package Description
,
DIMM, DIMM168
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.36
8542.32.00.36
Access Mode
FOUR BANK PAGE BURST
FOUR BANK PAGE BURST
Access Time-Max
6 ns
6 ns
Additional Feature
AUTO/SELF REFRESH
AUTO/SELF REFRESH
JESD-30 Code
R-XDMA-N168
R-XDMA-N168
Memory Density
2415919104 bit
2415919104 bit
Memory IC Type
SYNCHRONOUS DRAM MODULE
SYNCHRONOUS DRAM MODULE
Memory Width
72
72
Number of Functions
1
1
Number of Ports
1
1
Number of Terminals
168
168
Number of Words
33554432 words
33554432 words
Number of Words Code
32000000
32000000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Organization
32MX72
32MX72
Package Body Material
UNSPECIFIED
UNSPECIFIED
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
MICROELECTRONIC ASSEMBLY
MICROELECTRONIC ASSEMBLY
Peak Reflow Temperature (Cel)
235
Qualification Status
Not Qualified
Not Qualified
Self Refresh
YES
YES
Supply Voltage-Max (Vsup)
3.6 V
3.6 V
Supply Voltage-Min (Vsup)
3 V
3 V
Supply Voltage-Nom (Vsup)
3.3 V
3.3 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Form
NO LEAD
NO LEAD
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
30
Base Number Matches
1
1
Part Package Code
DIMM
Pin Count
168
Clock Frequency-Max (fCLK)
100 MHz
I/O Type
COMMON
Moisture Sensitivity Level
1
Output Characteristics
3-STATE
Package Code
DIMM
Package Equivalence Code
DIMM168
Refresh Cycles
4096
Standby Current-Max
0.018 A
Supply Current-Max
2.16 mA
Terminal Pitch
1.27 mm
Compare MT18LSDT3272G-10CXX with alternatives
Compare M374S3323BT0-C1H with alternatives