M372F3280DT1-C50
vs
HYS72V32200GR-8
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
SAMSUNG SEMICONDUCTOR INC
SIEMENS A G
Part Package Code
DIMM
DIMM
Package Description
DIMM, DIMM168
,
Pin Count
168
168
Reach Compliance Code
unknown
unknown
Access Mode
FAST PAGE WITH EDO
SINGLE BANK PAGE BURST
Access Time-Max
50 ns
6 ns
Additional Feature
RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH
I/O Type
COMMON
JESD-30 Code
R-XDMA-N168
R-XDMA-N168
Memory Density
2415919104 bit
2415919104 bit
Memory IC Type
EDO DRAM MODULE
SYNCHRONOUS DRAM MODULE
Memory Width
72
72
Number of Functions
1
1
Number of Ports
1
2
Number of Terminals
168
168
Number of Words
33554432 words
33554432 words
Number of Words Code
32000000
32000000
Operating Mode
ASYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Organization
32MX72
32MX72
Output Characteristics
3-STATE
Package Body Material
UNSPECIFIED
UNSPECIFIED
Package Code
DIMM
DIMM
Package Equivalence Code
DIMM168
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
MICROELECTRONIC ASSEMBLY
MICROELECTRONIC ASSEMBLY
Power Supplies
3.3 V
Qualification Status
Not Qualified
Not Qualified
Refresh Cycles
8192
Seated Height-Max
53.34 mm
Standby Current-Max
0.03 A
Supply Current-Max
1.998 mA
Supply Voltage-Max (Vsup)
3.6 V
3.6 V
Supply Voltage-Min (Vsup)
3 V
3 V
Supply Voltage-Nom (Vsup)
3.3 V
3.3 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Form
NO LEAD
NO LEAD
Terminal Pitch
1.27 mm
Terminal Position
DUAL
DUAL
Base Number Matches
2
2
ECCN Code
EAR99
HTS Code
8542.32.00.36
Compare M372F3280DT1-C50 with alternatives
Compare HYS72V32200GR-8 with alternatives