M36W832TE70ZA1T
vs
RD38F1020C0ZTL0
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
STMICROELECTRONICS
INTEL CORP
Part Package Code
BGA
BGA
Package Description
12 X 8 MM, 0.80 MM PITCH, LFBGA-66
LFBGA, BGA66,8X12,32
Pin Count
66
66
Reach Compliance Code
not_compliant
unknown
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.71
8542.32.00.71
Access Time-Max
70 ns
70 ns
Additional Feature
SRAM IS ORGANISED AS 512K X 16
SRAM IS ORGANIZED AS 512K X 16
JESD-30 Code
R-PBGA-B66
R-PBGA-B66
JESD-609 Code
e0
Length
12 mm
10 mm
Memory Density
33554432 bit
33554432 bit
Memory IC Type
MEMORY CIRCUIT
MEMORY CIRCUIT
Memory Width
16
16
Mixed Memory Type
FLASH+SRAM
FLASH+SRAM
Number of Functions
1
1
Number of Terminals
66
66
Number of Words
2097152 words
2097152 words
Number of Words Code
2000000
2000000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
70 °C
85 °C
Operating Temperature-Min
-25 °C
Organization
2MX16
2MX16
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LFBGA
LFBGA
Package Equivalence Code
BGA66,8X12,32
BGA66,8X12,32
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY, LOW PROFILE, FINE PITCH
GRID ARRAY, LOW PROFILE, FINE PITCH
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.4 mm
1.4 mm
Standby Current-Max
0.00002 A
0.000006 A
Supply Current-Max
0.02 mA
0.05 mA
Supply Voltage-Max (Vsup)
3.6 V
3.3 V
Supply Voltage-Min (Vsup)
2.7 V
2.7 V
Supply Voltage-Nom (Vsup)
3 V
3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
COMMERCIAL EXTENDED
Terminal Finish
TIN LEAD
Terminal Form
BALL
BALL
Terminal Pitch
0.8 mm
0.8 mm
Terminal Position
BOTTOM
BOTTOM
Width
8 mm
8 mm
Base Number Matches
1
1
Compare M36W832TE70ZA1T with alternatives
Compare RD38F1020C0ZTL0 with alternatives