RD38F1020C0ZTL0 vs M36W832TE100ZA1 feature comparison

RD38F1020C0ZTL0 Intel Corporation

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M36W832TE100ZA1 Numonyx Memory Solutions

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer INTEL CORP NUMONYX
Part Package Code BGA BGA
Package Description LFBGA, BGA66,8X12,32 0.80 MM PITCH, STACK, LFBGA-66
Pin Count 66 66
Reach Compliance Code unknown not_compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.71 8542.32.00.71
Access Time-Max 70 ns
Additional Feature SRAM IS ORGANIZED AS 512K X 16 ALSO CONTAINS 512K X 16 SRAM
JESD-30 Code R-PBGA-B66 R-PBGA-B66
Length 10 mm 12 mm
Memory Density 33554432 bit 33554432 bit
Memory IC Type MEMORY CIRCUIT MEMORY CIRCUIT
Memory Width 16 16
Mixed Memory Type FLASH+SRAM
Number of Functions 1 1
Number of Terminals 66 66
Number of Words 2097152 words 2097152 words
Number of Words Code 2000000 2000000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 85 °C 70 °C
Operating Temperature-Min -25 °C
Organization 2MX16 2MX16
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LFBGA LFBGA
Package Equivalence Code BGA66,8X12,32
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, LOW PROFILE, FINE PITCH GRID ARRAY, LOW PROFILE, FINE PITCH
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.4 mm 1.4 mm
Standby Current-Max 0.000006 A
Supply Current-Max 0.05 mA
Supply Voltage-Max (Vsup) 3.3 V 3.3 V
Supply Voltage-Min (Vsup) 2.7 V 2.7 V
Supply Voltage-Nom (Vsup) 3 V 3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL EXTENDED COMMERCIAL
Terminal Form BALL BALL
Terminal Pitch 0.8 mm 0.8 mm
Terminal Position BOTTOM BOTTOM
Width 8 mm 8 mm
Base Number Matches 1 2
Rohs Code No
JESD-609 Code e0
Terminal Finish Tin/Lead (Sn/Pb)

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Compare M36W832TE100ZA1 with alternatives