M36W0R6050L4ZAMF
vs
M36L0R8060B1ZAQF
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
MICRON TECHNOLOGY INC
NUMONYX
Part Package Code
BGA
BGA
Package Description
TFBGA, BGA88,8X12,32
TFBGA,
Pin Count
88
88
Reach Compliance Code
compliant
unknown
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.71
8542.32.00.71
Access Time-Max
70 ns
Additional Feature
IT ALSO HAVING 32-MBIT PSRAM
PSEUDO SRAM IS ORGANIZED AS 4M X 16; SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE
JESD-30 Code
R-PBGA-B88
R-PBGA-B88
JESD-609 Code
e1
e1
Length
10 mm
10 mm
Memory Density
67108864 bit
268435456 bit
Memory IC Type
MEMORY CIRCUIT
MEMORY CIRCUIT
Memory Width
16
16
Mixed Memory Type
FLASH+PSRAM
Number of Functions
1
1
Number of Terminals
88
88
Number of Words
4194304 words
16777216 words
Number of Words Code
4000000
16000000
Operating Mode
SYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-30 °C
-25 °C
Organization
4MX16
16MX16
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TFBGA
TFBGA
Package Equivalence Code
BGA88,8X12,32
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY, THIN PROFILE, FINE PITCH
GRID ARRAY, THIN PROFILE, FINE PITCH
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.2 mm
1.2 mm
Supply Voltage-Max (Vsup)
1.95 V
1.95 V
Supply Voltage-Min (Vsup)
1.7 V
1.7 V
Supply Voltage-Nom (Vsup)
1.8 V
1.8 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
OTHER
OTHER
Terminal Finish
TIN SILVER COPPER
TIN SILVER COPPER
Terminal Form
BALL
BALL
Terminal Pitch
0.8 mm
0.8 mm
Terminal Position
BOTTOM
BOTTOM
Width
8 mm
8 mm
Base Number Matches
2
2
Peak Reflow Temperature (Cel)
260
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Compare M36W0R6050L4ZAMF with alternatives
Compare M36L0R8060B1ZAQF with alternatives