M36P0R9060N0ZANF
vs
M36P0R9060N0ZANE
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
MICRON TECHNOLOGY INC
NUMONYX
Package Description
FBGA, BGA107,9X12,32
TFBGA, BGA107,9X12,32
Reach Compliance Code
compliant
unknown
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.71
8542.32.00.71
Access Time-Max
96 ns
96 ns
JESD-30 Code
R-PBGA-B107
R-PBGA-B107
Memory IC Type
MEMORY CIRCUIT
MEMORY CIRCUIT
Mixed Memory Type
FLASH+PSRAM
FLASH+PSRAM
Number of Terminals
107
107
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-30 °C
-30 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
FBGA
TFBGA
Package Equivalence Code
BGA107,9X12,32
BGA107,9X12,32
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY, FINE PITCH
GRID ARRAY, THIN PROFILE, FINE PITCH
Qualification Status
Not Qualified
Not Qualified
Supply Voltage-Nom (Vsup)
1.8 V
1.8 V
Surface Mount
YES
YES
Technology
HYBRID
CMOS
Temperature Grade
OTHER
OTHER
Terminal Form
BALL
BALL
Terminal Pitch
0.8 mm
0.8 mm
Terminal Position
BOTTOM
BOTTOM
Base Number Matches
2
2
Pbfree Code
Part Package Code
BGA
Pin Count
107
Additional Feature
SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE; PSRAM IS ORGANISED AS 4M X 16
Length
11 mm
Memory Density
536870912 bit
Memory Width
16
Number of Functions
1
Number of Words
33554432 words
Number of Words Code
32000000
Operating Mode
ASYNCHRONOUS
Organization
32MX16
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Seated Height-Max
1.2 mm
Supply Voltage-Max (Vsup)
1.95 V
Supply Voltage-Min (Vsup)
1.7 V
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Width
8 mm
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