M36P0R9060N0ZANE
vs
M36P0R8070E0ZACF
feature comparison
All Stats
Differences Only
Pbfree Code
Yes
Rohs Code
Yes
Yes
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
NUMONYX
NUMONYX
Part Package Code
BGA
BGA
Package Description
TFBGA, BGA107,9X12,32
TFBGA, BGA107,9X12,32
Pin Count
107
107
Reach Compliance Code
unknown
unknown
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.71
8542.32.00.71
Access Time-Max
96 ns
93 ns
Additional Feature
SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE; PSRAM IS ORGANISED AS 4M X 16
SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE; PSRAM IS ORGANISED AS 8M X 16
JESD-30 Code
R-PBGA-B107
R-PBGA-B107
Length
11 mm
11 mm
Memory Density
536870912 bit
268435456 bit
Memory IC Type
MEMORY CIRCUIT
MEMORY CIRCUIT
Memory Width
16
16
Mixed Memory Type
FLASH+PSRAM
FLASH+PSRAM
Number of Functions
1
1
Number of Terminals
107
107
Number of Words
33554432 words
16777216 words
Number of Words Code
32000000
16000000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-30 °C
-30 °C
Organization
32MX16
16MX16
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TFBGA
TFBGA
Package Equivalence Code
BGA107,9X12,32
BGA107,9X12,32
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY, THIN PROFILE, FINE PITCH
GRID ARRAY, THIN PROFILE, FINE PITCH
Peak Reflow Temperature (Cel)
NOT SPECIFIED
NOT SPECIFIED
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.2 mm
1.2 mm
Supply Voltage-Max (Vsup)
1.95 V
1.95 V
Supply Voltage-Min (Vsup)
1.7 V
1.7 V
Supply Voltage-Nom (Vsup)
1.8 V
1.8 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
OTHER
OTHER
Terminal Form
BALL
BALL
Terminal Pitch
0.8 mm
0.8 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
NOT SPECIFIED
Width
8 mm
8 mm
Base Number Matches
2
3
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