M36L0R8060B1ZAQ vs PF38F1030W0ZBQ0 feature comparison

M36L0R8060B1ZAQ Numonyx Memory Solutions

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PF38F1030W0ZBQ0 Micron Technology Inc

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Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer NUMONYX MICRON TECHNOLOGY INC
Part Package Code BGA BGA
Package Description TFBGA, TFBGA, BGA88,8X12,32
Pin Count 88 88
Reach Compliance Code unknown compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.71 8542.32.00.71
Additional Feature PSEUDO SRAM IS ORGANIZED AS 4M X 16; SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE CONTAINS 16 MBIT SRAM, ALSO CONTAINS 64 MBIT FLASH
JESD-30 Code R-PBGA-B88 R-PBGA-B88
JESD-609 Code e0
Length 10 mm 10 mm
Memory Density 268435456 bit 67108864 bit
Memory IC Type MEMORY CIRCUIT MEMORY CIRCUIT
Memory Width 16 16
Number of Functions 1 1
Number of Terminals 88 88
Number of Words 16777216 words 4194304 words
Number of Words Code 16000000 4000000
Operating Mode ASYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -25 °C -25 °C
Organization 16MX16 4MX16
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TFBGA TFBGA
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, THIN PROFILE, FINE PITCH GRID ARRAY, THIN PROFILE, FINE PITCH
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.2 mm 1.2 mm
Supply Voltage-Max (Vsup) 1.95 V 1.95 V
Supply Voltage-Min (Vsup) 1.7 V 1.7 V
Supply Voltage-Nom (Vsup) 1.8 V 1.8 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade OTHER OTHER
Terminal Finish Tin/Lead (Sn/Pb)
Terminal Form BALL BALL
Terminal Pitch 0.8 mm 0.8 mm
Terminal Position BOTTOM BOTTOM
Width 8 mm 8 mm
Base Number Matches 4 1
Pbfree Code Yes
Rohs Code Yes
Mixed Memory Type FLASH+PSRAM
Package Equivalence Code BGA88,8X12,32
Peak Reflow Temperature (Cel) 260
Standby Current-Max 0.000005 A
Supply Current-Max 0.055 mA
Time@Peak Reflow Temperature-Max (s) 30

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Compare PF38F1030W0ZBQ0 with alternatives