M3062JFHVFP-B
vs
M30853FWGP
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
RENESAS ELECTRONICS CORP
RENESAS ELECTRONICS CORP
Part Package Code
QFP
QFP
Package Description
QFP,
LFQFP, QFP100,.63SQ,20
Pin Count
100
100
Reach Compliance Code
compliant
compliant
HTS Code
8542.31.00.01
8542.31.00.01
Has ADC
YES
YES
Address Bus Width
20
24
Bit Size
16
32
Clock Frequency-Max
16 MHz
32 MHz
DAC Channels
YES
YES
DMA Channels
YES
YES
External Data Bus Width
16
16
JESD-30 Code
R-PQFP-G100
S-PQFP-G100
Length
20 mm
14 mm
Number of I/O Lines
88
88
Number of Terminals
100
100
Operating Temperature-Max
125 °C
85 °C
Operating Temperature-Min
-40 °C
-20 °C
PWM Channels
YES
YES
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
QFP
LFQFP
Package Shape
RECTANGULAR
SQUARE
Package Style
FLATPACK
FLATPACK, LOW PROFILE, FINE PITCH
Qualification Status
Not Qualified
Not Qualified
ROM Programmability
FLASH
FLASH
Seated Height-Max
3.05 mm
1.7 mm
Speed
24 MHz
32 MHz
Supply Voltage-Max
5.5 V
5.5 V
Supply Voltage-Min
4 V
5 V
Supply Voltage-Nom
5 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
AUTOMOTIVE
OTHER
Terminal Form
GULL WING
GULL WING
Terminal Pitch
0.65 mm
0.5 mm
Terminal Position
QUAD
QUAD
Width
14 mm
14 mm
uPs/uCs/Peripheral ICs Type
MICROCONTROLLER
MICROCONTROLLER
Base Number Matches
1
1
Pbfree Code
Rohs Code
ECCN Code
3A991.A.2
Additional Feature
ALSO OPERATES AT 3V MINIMUM SUPPLY AT 24 MHZ
CPU Family
M32C/80
JESD-609 Code
e2
Moisture Sensitivity Level
3
On Chip Program ROM Width
8
Package Equivalence Code
QFP100,.63SQ,20
Peak Reflow Temperature (Cel)
260
RAM (bytes)
24576
ROM (words)
331776
Supply Current-Max
45 mA
Terminal Finish
Tin/Copper (Sn/Cu)
Time@Peak Reflow Temperature-Max (s)
20
Compare M3062JFHVFP-B with alternatives
Compare M30853FWGP with alternatives