M30201F6TFP
vs
M30201F6T-SP
feature comparison
| Rohs Code |
No
|
|
| Part Life Cycle Code |
Transferred
|
Obsolete
|
| Ihs Manufacturer |
MITSUBISHI ELECTRIC CORP
|
MITSUBISHI ELECTRIC CORP
|
| Part Package Code |
QFP
|
DIP
|
| Package Description |
10 X 10 MM, 0.65 MM PITCH, PLASTIC, QFP-56
|
SHRINK, PLASTIC, DIP-52
|
| Pin Count |
56
|
52
|
| Reach Compliance Code |
unknown
|
unknown
|
| HTS Code |
8542.31.00.01
|
|
| Has ADC |
YES
|
YES
|
| Address Bus Width |
|
|
| Bit Size |
16
|
16
|
| CPU Family |
M16C
|
|
| Clock Frequency-Max |
10 MHz
|
10 MHz
|
| DAC Channels |
NO
|
NO
|
| DMA Channels |
NO
|
NO
|
| External Data Bus Width |
|
|
| JESD-30 Code |
S-PQFP-G56
|
R-PDIP-T52
|
| JESD-609 Code |
e0
|
|
| Length |
10 mm
|
45.85 mm
|
| Number of I/O Lines |
43
|
43
|
| Number of Terminals |
56
|
52
|
| On Chip Program ROM Width |
8
|
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-20 °C
|
-20 °C
|
| PWM Channels |
YES
|
YES
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
QFP
|
SDIP
|
| Package Equivalence Code |
QFP56,.53SQ
|
|
| Package Shape |
SQUARE
|
RECTANGULAR
|
| Package Style |
FLATPACK
|
IN-LINE, SHRINK PITCH
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| RAM (bytes) |
2048
|
|
| ROM (words) |
49152
|
|
| ROM Programmability |
FLASH
|
FLASH
|
| Seated Height-Max |
3.05 mm
|
5.5 mm
|
| Speed |
10 MHz
|
10 MHz
|
| Supply Current-Max |
38 mA
|
|
| Supply Voltage-Max |
5.5 V
|
5.5 V
|
| Supply Voltage-Min |
4 V
|
4 V
|
| Supply Voltage-Nom |
5 V
|
5 V
|
| Surface Mount |
YES
|
NO
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
OTHER
|
OTHER
|
| Terminal Finish |
Tin/Lead (Sn/Pb)
|
|
| Terminal Form |
GULL WING
|
THROUGH-HOLE
|
| Terminal Pitch |
0.65 mm
|
1.778 mm
|
| Terminal Position |
QUAD
|
DUAL
|
| Width |
10 mm
|
15.24 mm
|
| uPs/uCs/Peripheral ICs Type |
MICROCONTROLLER
|
MICROCONTROLLER
|
| Base Number Matches |
2
|
1
|
|
|
|
Compare M30201F6TFP with alternatives
Compare M30201F6T-SP with alternatives