M2S150-1FCS536I
vs
M2S150-1FCSG536
feature comparison
Rohs Code |
No
|
Yes
|
Part Life Cycle Code |
Active
|
Active
|
Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MICROCHIP TECHNOLOGY INC
|
Package Description |
FBGA-536
|
FBGA-536
|
Reach Compliance Code |
not_compliant
|
compliant
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Factory Lead Time |
10 Weeks
|
10 Weeks
|
JESD-30 Code |
S-PBGA-B536
|
S-PBGA-B536
|
JESD-609 Code |
e0
|
e1
|
Number of Inputs |
293
|
293
|
Number of Logic Cells |
146124
|
146124
|
Number of Outputs |
293
|
293
|
Number of Terminals |
536
|
536
|
Operating Temperature-Max |
100 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
BGA
|
BGA
|
Package Equivalence Code |
BGA536,30X30,20
|
BGA536,30X30,20
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
GRID ARRAY
|
GRID ARRAY
|
Packing Method |
TRAY
|
TRAY
|
Peak Reflow Temperature (Cel) |
240
|
250
|
Programmable Logic Type |
FPGA SOC
|
FPGA SOC
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Supply Voltage-Max |
1.26 V
|
1.26 V
|
Supply Voltage-Min |
1.14 V
|
1.14 V
|
Supply Voltage-Nom |
1.2 V
|
1.2 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Terminal Finish |
Tin/Lead (Sn/Pb)
|
Tin/Silver/Copper (Sn/Ag/Cu)
|
Terminal Form |
BALL
|
BALL
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Time@Peak Reflow Temperature-Max (s) |
30
|
40
|
Base Number Matches |
1
|
2
|
Moisture Sensitivity Level |
|
3
|
|
|
|
Compare M2S150-1FCS536I with alternatives
Compare M2S150-1FCSG536 with alternatives