M2S150-1FCS536I
vs
M2S150-1FCS536
feature comparison
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Transferred
|
Active
|
| Ihs Manufacturer |
MICROSEMI CORP
|
MICROCHIP TECHNOLOGY INC
|
| Package Description |
BGA, BGA536,30X30,20
|
FBGA-536
|
| Reach Compliance Code |
not_compliant
|
not_compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| JESD-30 Code |
S-PBGA-B536
|
S-PBGA-B536
|
| JESD-609 Code |
e0
|
e0
|
| Number of Inputs |
293
|
293
|
| Number of Logic Cells |
146124
|
146124
|
| Number of Outputs |
293
|
293
|
| Number of Terminals |
536
|
536
|
| Operating Temperature-Max |
100 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
BGA
|
BGA
|
| Package Equivalence Code |
BGA536,30X30,20
|
BGA536,30X30,20
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
GRID ARRAY
|
GRID ARRAY
|
| Peak Reflow Temperature (Cel) |
240
|
240
|
| Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY
|
FPGA SOC
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Supply Voltage-Max |
1.26 V
|
1.26 V
|
| Supply Voltage-Min |
1.14 V
|
1.14 V
|
| Supply Voltage-Nom |
1.2 V
|
1.2 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Terminal Finish |
Tin/Lead (Sn/Pb)
|
Tin/Lead (Sn/Pb)
|
| Terminal Form |
BALL
|
BALL
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
| Base Number Matches |
2
|
2
|
| Factory Lead Time |
|
10 Weeks
|
| Packing Method |
|
TRAY
|
|
|
|
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