M2GL005S-1VFG400T2
vs
M2S005-1VF400YI
feature comparison
| Pbfree Code |
Yes
|
|
| Rohs Code |
Yes
|
No
|
| Part Life Cycle Code |
Transferred
|
Transferred
|
| Ihs Manufacturer |
MICROSEMI CORP
|
MICROSEMI CORP
|
| Reach Compliance Code |
compliant
|
unknown
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Operating Temperature-Max |
125 °C
|
|
| Operating Temperature-Min |
-40 °C
|
|
| Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
|
| Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY
|
FIELD PROGRAMMABLE GATE ARRAY
|
| Temperature Grade |
AUTOMOTIVE
|
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
|
| Base Number Matches |
2
|
2
|
| Package Description |
|
FBGA, BGA400,20X20,32
|
| JESD-30 Code |
|
S-PBGA-B400
|
| Number of Inputs |
|
160
|
| Number of Logic Cells |
|
4956
|
| Number of Outputs |
|
160
|
| Number of Terminals |
|
400
|
| Package Body Material |
|
PLASTIC
|
| Package Code |
|
FBGA
|
| Package Equivalence Code |
|
BGA400,20X20,32
|
| Package Shape |
|
SQUARE
|
| Package Style |
|
GRID ARRAY, FINE PITCH
|
| Qualification Status |
|
Not Qualified
|
| Supply Voltage-Nom |
|
1.2 V
|
| Surface Mount |
|
YES
|
| Technology |
|
CMOS
|
| Terminal Form |
|
BALL
|
| Terminal Pitch |
|
0.8 mm
|
| Terminal Position |
|
BOTTOM
|
|
|
|