M29W640GL90ZS3F
vs
RC28F640J3D-75
feature comparison
| Rohs Code |
Yes
|
No
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
MICRON TECHNOLOGY INC
|
MICRON TECHNOLOGY INC
|
| Package Description |
,
|
|
| Reach Compliance Code |
compliant
|
unknown
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.32.00.51
|
8542.32.00.51
|
| Memory IC Type |
FLASH
|
FLASH
|
| Programming Voltage |
3 V
|
|
| Type |
NOR TYPE
|
NOR TYPE
|
| Base Number Matches |
2
|
3
|
| Access Time-Max |
|
75 ns
|
| Alternate Memory Width |
|
8
|
| Command User Interface |
|
YES
|
| Common Flash Interface |
|
YES
|
| Data Polling |
|
NO
|
| JESD-30 Code |
|
S-PBGA-B64
|
| JESD-609 Code |
|
e0
|
| Memory Density |
|
67108864 bit
|
| Memory Width |
|
16
|
| Number of Sectors/Size |
|
64
|
| Number of Terminals |
|
64
|
| Number of Words |
|
4194304 words
|
| Number of Words Code |
|
4000000
|
| Operating Temperature-Max |
|
85 °C
|
| Operating Temperature-Min |
|
-40 °C
|
| Organization |
|
4MX16
|
| Package Body Material |
|
PLASTIC/EPOXY
|
| Package Code |
|
BGA
|
| Package Equivalence Code |
|
BGA64,8X8,40
|
| Package Shape |
|
SQUARE
|
| Package Style |
|
GRID ARRAY
|
| Page Size |
|
4/8 words
|
| Parallel/Serial |
|
PARALLEL
|
| Qualification Status |
|
Not Qualified
|
| Ready/Busy |
|
YES
|
| Sector Size |
|
128K
|
| Standby Current-Max |
|
0.00012 A
|
| Supply Current-Max |
|
0.054 mA
|
| Surface Mount |
|
YES
|
| Technology |
|
CMOS
|
| Temperature Grade |
|
INDUSTRIAL
|
| Terminal Finish |
|
Tin/Lead (Sn/Pb)
|
| Terminal Form |
|
BALL
|
| Terminal Pitch |
|
1 mm
|
| Terminal Position |
|
BOTTOM
|
| Toggle Bit |
|
NO
|
|
|
|
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