M29W640GL90ZS3F
vs
S29GL064N90FFI010
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
MICRON TECHNOLOGY INC
SPANSION INC
Package Description
,
13 X 11 MM, LEAD FREE, FBGA-64
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
3A991.B.1.A
HTS Code
8542.32.00.51
8542.32.00.51
Memory IC Type
FLASH
FLASH
Programming Voltage
3 V
3 V
Type
NOR TYPE
NOR TYPE
Base Number Matches
2
3
Pbfree Code
Part Package Code
BGA
Pin Count
64
Access Time-Max
90 ns
Alternate Memory Width
8
Command User Interface
YES
Common Flash Interface
YES
Data Polling
YES
JESD-30 Code
R-PBGA-B64
JESD-609 Code
e1
Length
13 mm
Memory Density
67108864 bit
Memory Width
16
Moisture Sensitivity Level
3
Number of Functions
1
Number of Sectors/Size
128
Number of Terminals
64
Number of Words
4194304 words
Number of Words Code
4000000
Operating Mode
ASYNCHRONOUS
Operating Temperature-Max
85 °C
Operating Temperature-Min
-40 °C
Organization
4MX16
Package Body Material
PLASTIC/EPOXY
Package Code
LBGA
Package Equivalence Code
BGA64,8X8,40
Package Shape
RECTANGULAR
Package Style
GRID ARRAY, LOW PROFILE
Page Size
8/16 words
Parallel/Serial
PARALLEL
Peak Reflow Temperature (Cel)
260
Qualification Status
Not Qualified
Ready/Busy
YES
Seated Height-Max
1.4 mm
Sector Size
64K
Standby Current-Max
0.000005 A
Supply Current-Max
0.05 mA
Supply Voltage-Max (Vsup)
3.6 V
Supply Voltage-Min (Vsup)
2.7 V
Supply Voltage-Nom (Vsup)
3 V
Surface Mount
YES
Technology
CMOS
Temperature Grade
INDUSTRIAL
Terminal Finish
TIN SILVER COPPER
Terminal Form
BALL
Terminal Pitch
1 mm
Terminal Position
BOTTOM
Time@Peak Reflow Temperature-Max (s)
40
Toggle Bit
YES
Width
11 mm
Compare M29W640GL90ZS3F with alternatives
Compare S29GL064N90FFI010 with alternatives