M29W640FB70ZA6F vs M29W640GL70ZA3E feature comparison

M29W640FB70ZA6F Micron Technology Inc

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M29W640GL70ZA3E Numonyx Memory Solutions

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Pbfree Code Yes
Rohs Code Yes
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer MICRON TECHNOLOGY INC NUMONYX
Part Package Code BGA BGA
Package Description TFBGA, BGA48,6X8,32 6 X 8 MM, 0.80 MM PITCH, ROHS COMPLIANT, TFBGA-48
Pin Count 48 48
Reach Compliance Code compliant unknown
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.51 8542.32.00.51
Category CO2 Kg 12 12
Compliance Temperature Grade Industrial: -40C to +85C Automotive: -40C to +125C
EU RoHS Version RoHS 2 (2015/863/EU)
Candidate List Date 2018-06-27
EFUP e
Conflict Mineral Status DRC Conflict Free
Conflict Mineral Status Source CMRT V4.01b
Access Time-Max 70 ns 70 ns
Additional Feature BOTTOM BOOT BLOCK TOP BOOT BLOCK
Alternate Memory Width 8 8
Boot Block BOTTOM TOP
Command User Interface YES
Common Flash Interface YES
Data Polling YES
JESD-30 Code R-PBGA-B48 R-PBGA-B48
JESD-609 Code e1
Length 8 mm 8 mm
Memory Density 67108864 bit 67108864 bit
Memory IC Type FLASH FLASH
Memory Width 16 16
Number of Functions 1 1
Number of Sectors/Size 8,127
Number of Terminals 48 48
Number of Words 4194304 words 4194304 words
Number of Words Code 4000000 4000000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Organization 4MX16 4MX16
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TFBGA TFBGA
Package Equivalence Code BGA48,6X8,32
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, THIN PROFILE, FINE PITCH GRID ARRAY, THIN PROFILE, FINE PITCH
Page Size 4/8 words
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) 260
Programming Voltage 3 V 3 V
Qualification Status Not Qualified Not Qualified
Ready/Busy YES
Seated Height-Max 1.2 mm 1.2 mm
Sector Size 8K,64K
Standby Current-Max 0.0001 A
Supply Current-Max 0.02 mA
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 2.7 V 2.7 V
Supply Voltage-Nom (Vsup) 3 V 3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL AUTOMOTIVE
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Form BALL BALL
Terminal Pitch 0.8 mm 0.8 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30
Toggle Bit YES
Type NOR TYPE NOR TYPE
Width 6 mm 6 mm
Base Number Matches 3 2

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