M29DW324DB90ZA1 vs MBM29DL322BE90PBT-E1 feature comparison

M29DW324DB90ZA1 STMicroelectronics

Buy Now Datasheet

MBM29DL322BE90PBT-E1 Spansion

Buy Now Datasheet
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer STMICROELECTRONICS SPANSION INC
Part Package Code BGA BGA
Package Description 7 X 11 MM, 0.80 MM PITCH, TFBGA-63 PLASTIC, FBGA-63
Pin Count 63 63
Reach Compliance Code unknown compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.51 8542.32.00.51
Access Time-Max 90 ns 90 ns
Additional Feature BOTTOM BOOT BLOCK ALSO CONFIGURABLE AS 4M X 8
Alternate Memory Width 8 8
Boot Block BOTTOM BOTTOM
JESD-30 Code R-PBGA-B63 R-PBGA-B63
Length 11 mm 11 mm
Memory Density 33554432 bit 33554432 bit
Memory IC Type FLASH FLASH
Memory Width 16 16
Number of Functions 1 1
Number of Terminals 63 63
Number of Words 2097152 words 2097152 words
Number of Words Code 2000000 2000000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 70 °C 85 °C
Operating Temperature-Min -40 °C
Organization 2MX16 2MX16
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TFBGA TFBGA
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, THIN PROFILE, FINE PITCH GRID ARRAY, THIN PROFILE, FINE PITCH
Parallel/Serial PARALLEL PARALLEL
Programming Voltage 3 V 3 V
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.2 mm 1.2 mm
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 2.7 V 2.7 V
Supply Voltage-Nom (Vsup) 3 V 3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL INDUSTRIAL
Terminal Form BALL BALL
Terminal Pitch 0.8 mm 0.8 mm
Terminal Position BOTTOM BOTTOM
Type NOR TYPE NOR TYPE
Width 7 mm 7 mm
Base Number Matches 2 1
Rohs Code Yes
JESD-609 Code e1
Terminal Finish TIN SILVER COPPER

Compare M29DW324DB90ZA1 with alternatives

Compare MBM29DL322BE90PBT-E1 with alternatives