M28W640HCB70ZB6F
vs
K8D6316UBM-YI070
feature comparison
| Pbfree Code |
Yes
|
|
| Rohs Code |
Yes
|
No
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
MICRON TECHNOLOGY INC
|
SAMSUNG SEMICONDUCTOR INC
|
| Part Package Code |
BGA
|
TSOP1
|
| Package Description |
TFBGA, BGA48,6X8,30
|
12 X 20 MM, 0.50 MM PITCH, PLASTIC, TSOP1-48
|
| Pin Count |
48
|
48
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.32.00.51
|
8542.32.00.51
|
| Access Time-Max |
70 ns
|
70 ns
|
| Additional Feature |
BOTTOM BOOT BLOCK
|
|
| Boot Block |
BOTTOM
|
BOTTOM
|
| Command User Interface |
YES
|
YES
|
| Common Flash Interface |
YES
|
YES
|
| Data Polling |
NO
|
YES
|
| JESD-30 Code |
R-PBGA-B48
|
R-PDSO-G48
|
| JESD-609 Code |
e1
|
|
| Length |
10.5 mm
|
18.4 mm
|
| Memory Density |
67108864 bit
|
67108864 bit
|
| Memory IC Type |
FLASH
|
FLASH
|
| Memory Width |
16
|
16
|
| Number of Functions |
1
|
1
|
| Number of Sectors/Size |
8,127
|
8,127
|
| Number of Terminals |
48
|
48
|
| Number of Words |
4194304 words
|
4194304 words
|
| Number of Words Code |
4000000
|
4000000
|
| Operating Mode |
ASYNCHRONOUS
|
ASYNCHRONOUS
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Organization |
4MX16
|
4MX16
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
TFBGA
|
TSOP1
|
| Package Equivalence Code |
BGA48,6X8,30
|
TSSOP56,.8,20
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
GRID ARRAY, THIN PROFILE, FINE PITCH
|
SMALL OUTLINE, THIN PROFILE
|
| Page Size |
4 words
|
|
| Parallel/Serial |
PARALLEL
|
PARALLEL
|
| Programming Voltage |
3 V
|
2.7 V
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1.2 mm
|
1.2 mm
|
| Sector Size |
4K,32K
|
8K,64K
|
| Standby Current-Max |
0.000005 A
|
0.00003 A
|
| Supply Current-Max |
0.02 mA
|
0.05 mA
|
| Supply Voltage-Max (Vsup) |
3.6 V
|
3.6 V
|
| Supply Voltage-Min (Vsup) |
2.7 V
|
2.7 V
|
| Supply Voltage-Nom (Vsup) |
3 V
|
3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
TIN SILVER COPPER
|
|
| Terminal Form |
BALL
|
GULL WING
|
| Terminal Pitch |
0.75 mm
|
0.5 mm
|
| Terminal Position |
BOTTOM
|
DUAL
|
| Toggle Bit |
NO
|
YES
|
| Type |
NOR TYPE
|
NOR TYPE
|
| Width |
6.39 mm
|
12 mm
|
| Base Number Matches |
3
|
1
|
| Alternate Memory Width |
|
8
|
| Moisture Sensitivity Level |
|
1
|
| Ready/Busy |
|
YES
|
|
|
|
Compare M28W640HCB70ZB6F with alternatives
Compare K8D6316UBM-YI070 with alternatives