M28W640HCB70ZB6F
vs
SST39VF6401-70-4C-EKE
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
MICRON TECHNOLOGY INC
MICROCHIP TECHNOLOGY INC
Part Package Code
BGA
TSOP1
Package Description
TFBGA, BGA48,6X8,30
12 X 20 MM, ROHS COMPLIANT, MO-142DD, TSOP1-48
Pin Count
48
48
Reach Compliance Code
compliant
unknown
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.51
8542.32.00.51
Access Time-Max
70 ns
70 ns
Additional Feature
BOTTOM BOOT BLOCK
BOTTOM BOOT BLOCK
Boot Block
BOTTOM
BOTTOM
Command User Interface
YES
Common Flash Interface
YES
Data Polling
NO
JESD-30 Code
R-PBGA-B48
R-PDSO-G48
JESD-609 Code
e1
Length
10.5 mm
18.4 mm
Memory Density
67108864 bit
67108864 bit
Memory IC Type
FLASH
FLASH
Memory Width
16
16
Number of Functions
1
1
Number of Sectors/Size
8,127
Number of Terminals
48
48
Number of Words
4194304 words
4194304 words
Number of Words Code
4000000
4000000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
85 °C
70 °C
Operating Temperature-Min
-40 °C
Organization
4MX16
4MX16
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TFBGA
TSOP1
Package Equivalence Code
BGA48,6X8,30
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY, THIN PROFILE, FINE PITCH
SMALL OUTLINE, THIN PROFILE
Page Size
4 words
Parallel/Serial
PARALLEL
PARALLEL
Programming Voltage
3 V
2.7 V
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.2 mm
1.2 mm
Sector Size
4K,32K
Standby Current-Max
0.000005 A
Supply Current-Max
0.02 mA
Supply Voltage-Max (Vsup)
3.6 V
3.6 V
Supply Voltage-Min (Vsup)
2.7 V
2.7 V
Supply Voltage-Nom (Vsup)
3 V
3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
COMMERCIAL
Terminal Finish
TIN SILVER COPPER
Terminal Form
BALL
GULL WING
Terminal Pitch
0.75 mm
0.5 mm
Terminal Position
BOTTOM
DUAL
Toggle Bit
NO
Type
NOR TYPE
NOR TYPE
Width
6.39 mm
12 mm
Base Number Matches
3
2
Compare M28W640HCB70ZB6F with alternatives
Compare SST39VF6401-70-4C-EKE with alternatives