M28256-20WKA1
vs
WS57C256F-70T
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
STMICROELECTRONICS
WAFERSCALE INTEGRATION INC
Part Package Code
QFJ
Package Description
QCCJ, LDCC32,.5X.6
0.300 INCH, CERDIP-28
Pin Count
32
Reach Compliance Code
compliant
unknown
ECCN Code
EAR99
HTS Code
8542.32.00.51
Access Time-Max
200 ns
70 ns
Command User Interface
NO
Data Polling
YES
Endurance
100000 Write/Erase Cycles
JESD-30 Code
R-PQCC-J32
R-GDIP-T28
JESD-609 Code
e3
e0
Length
13.995 mm
Memory Density
262144 bit
262144 bit
Memory IC Type
EEPROM
UVPROM
Memory Width
8
8
Number of Functions
1
1
Number of Terminals
32
28
Number of Words
32768 words
32768 words
Number of Words Code
32000
32000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Organization
32KX8
32KX8
Output Characteristics
3-STATE
3-STATE
Package Body Material
PLASTIC/EPOXY
CERAMIC, GLASS-SEALED
Package Code
QCCJ
DIP
Package Equivalence Code
LDCC32,.5X.6
DIP28,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
CHIP CARRIER
IN-LINE
Page Size
64 words
Parallel/Serial
PARALLEL
PARALLEL
Programming Voltage
3 V
12.5 V
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
3.56 mm
Standby Current-Max
0.00002 A
0.0005 A
Supply Current-Max
0.015 mA
0.107 mA
Supply Voltage-Max (Vsup)
3.6 V
5.5 V
Supply Voltage-Min (Vsup)
2.7 V
4.5 V
Supply Voltage-Nom (Vsup)
3 V
5 V
Surface Mount
YES
NO
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Finish
MATTE TIN
Tin/Lead (Sn/Pb)
Terminal Form
J BEND
THROUGH-HOLE
Terminal Pitch
1.27 mm
2.54 mm
Terminal Position
QUAD
DUAL
Toggle Bit
YES
Width
11.455 mm
Write Cycle Time-Max (tWC)
5 ms
Base Number Matches
1
3
I/O Type
COMMON
Compare M28256-20WKA1 with alternatives
Compare WS57C256F-70T with alternatives