M27V322-150S6 vs KM23C32000-25 feature comparison

M27V322-150S6 STMicroelectronics

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KM23C32000-25 Samsung Semiconductor

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Rohs Code Yes No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer STMICROELECTRONICS SAMSUNG SEMICONDUCTOR INC
Part Package Code DIP DIP
Package Description 0.600 INCH, ROHS COMPLIANT, PLASTIC, SDIP-42 DIP, DIP42,.6
Pin Count 42 42
Reach Compliance Code compliant unknown
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.71 8542.32.00.71
Access Time-Max 150 ns 250 ns
I/O Type COMMON
JESD-30 Code R-PDIP-T42 R-PDIP-T42
JESD-609 Code e3 e0
Length 36.83 mm 52.43 mm
Memory Density 33554432 bit 33554432 bit
Memory IC Type OTP ROM MASK ROM
Memory Width 16 16
Number of Functions 1 1
Number of Terminals 42 42
Number of Words 2097152 words 2097152 words
Number of Words Code 2000000 2000000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 85 °C 70 °C
Operating Temperature-Min -40 °C
Organization 2MX16 2MX16
Output Characteristics 3-STATE 3-STATE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SDIP DIP
Package Equivalence Code SDIP42,.6 DIP42,.6
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE, SHRINK PITCH IN-LINE
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Seated Height-Max 5.08 mm 5.08 mm
Standby Current-Max 0.00006 A 0.00005 A
Supply Current-Max 0.03 mA 0.06 mA
Supply Voltage-Max (Vsup) 3.63 V 5.5 V
Supply Voltage-Min (Vsup) 2.97 V 4.5 V
Supply Voltage-Nom (Vsup) 3.3 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade INDUSTRIAL COMMERCIAL
Terminal Finish TIN TIN LEAD
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 1.778 mm 2.54 mm
Terminal Position DUAL DUAL
Width 15.24 mm 15.24 mm
Base Number Matches 1 1
Pbfree Code No

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