M27V201-200B6
vs
HY27UH08AG5BTC
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
STMICROELECTRONICS
SK HYNIX INC
Part Package Code
DIP
TSOP1
Package Description
DIP, DIP32,.6
TSOP1,
Pin Count
32
48
Reach Compliance Code
compliant
unknown
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.71
8542.32.00.51
Access Time-Max
200 ns
I/O Type
COMMON
JESD-30 Code
R-PDIP-T32
R-PDSO-G48
JESD-609 Code
e3
Length
41.91 mm
18.4 mm
Memory Density
2097152 bit
17179869184 bit
Memory IC Type
OTP ROM
FLASH
Memory Width
8
8
Number of Functions
1
1
Number of Terminals
32
48
Number of Words
262144 words
2147483648 words
Number of Words Code
256000
2000000000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
85 °C
70 °C
Operating Temperature-Min
-40 °C
Organization
256KX8
2GX8
Output Characteristics
3-STATE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
DIP
TSOP1
Package Equivalence Code
DIP32,.6
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
SMALL OUTLINE
Parallel/Serial
PARALLEL
SERIAL
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
5.08 mm
1.2 mm
Standby Current-Max
0.00002 A
Supply Current-Max
0.015 mA
Supply Voltage-Max (Vsup)
3.6 V
3.6 V
Supply Voltage-Min (Vsup)
3 V
2.7 V
Supply Voltage-Nom (Vsup)
3.3 V
3.3 V
Surface Mount
NO
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
COMMERCIAL
Terminal Finish
MATTE TIN
Terminal Form
THROUGH-HOLE
GULL WING
Terminal Pitch
2.54 mm
0.5 mm
Terminal Position
DUAL
DUAL
Width
15.24 mm
12 mm
Base Number Matches
1
1
Programming Voltage
3.3 V
Type
SLC NAND TYPE
Compare M27V201-200B6 with alternatives
Compare HY27UH08AG5BTC with alternatives