HY27UH08AG5BTC
vs
AM27C64-150PC
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
SK HYNIX INC
SPANSION INC
Part Package Code
TSOP1
DIP
Package Description
TSOP1,
DIP, DIP28,.6
Pin Count
48
28
Reach Compliance Code
unknown
unknown
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.51
8542.32.00.71
JESD-30 Code
R-PDSO-G48
R-PDIP-T28
Length
18.4 mm
37.084 mm
Memory Density
17179869184 bit
65536 bit
Memory IC Type
FLASH
OTP ROM
Memory Width
8
8
Number of Functions
1
1
Number of Terminals
48
28
Number of Words
2147483648 words
8192 words
Number of Words Code
2000000000
8000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Organization
2GX8
8KX8
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TSOP1
DIP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE
IN-LINE
Parallel/Serial
SERIAL
PARALLEL
Programming Voltage
3.3 V
12.75 V
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.2 mm
5.715 mm
Supply Voltage-Max (Vsup)
3.6 V
5.5 V
Supply Voltage-Min (Vsup)
2.7 V
4.5 V
Supply Voltage-Nom (Vsup)
3.3 V
5 V
Surface Mount
YES
NO
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Form
GULL WING
THROUGH-HOLE
Terminal Pitch
0.5 mm
2.54 mm
Terminal Position
DUAL
DUAL
Type
SLC NAND TYPE
Width
12 mm
15.24 mm
Base Number Matches
1
4
Rohs Code
No
Access Time-Max
150 ns
I/O Type
COMMON
Moisture Sensitivity Level
1
Output Characteristics
3-STATE
Package Equivalence Code
DIP28,.6
Standby Current-Max
0.0001 A
Supply Current-Max
0.025 mA
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