M27V160-150XK1TR
vs
M27C1024-55B3
feature comparison
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
STMICROELECTRONICS
|
STMICROELECTRONICS
|
Part Package Code |
LCC
|
DIP
|
Package Description |
QCCJ, LDCC44,.7SQ
|
DIP, DIP40,.6
|
Pin Count |
44
|
40
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.32.00.71
|
8542.32.00.71
|
Access Time-Max |
150 ns
|
55 ns
|
Alternate Memory Width |
8
|
|
I/O Type |
COMMON
|
COMMON
|
JESD-30 Code |
S-PQCC-J44
|
R-PDIP-T40
|
JESD-609 Code |
e3
|
e3
|
Length |
16.586 mm
|
52.18 mm
|
Memory Density |
16777216 bit
|
1048576 bit
|
Memory IC Type |
OTP ROM
|
OTP ROM
|
Memory Width |
16
|
16
|
Number of Functions |
1
|
1
|
Number of Terminals |
44
|
40
|
Number of Words |
1048576 words
|
65536 words
|
Number of Words Code |
1000000
|
64000
|
Operating Mode |
ASYNCHRONOUS
|
ASYNCHRONOUS
|
Operating Temperature-Max |
70 °C
|
125 °C
|
Operating Temperature-Min |
|
-40 °C
|
Organization |
1MX16
|
64KX16
|
Output Characteristics |
3-STATE
|
3-STATE
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
QCCJ
|
DIP
|
Package Equivalence Code |
LDCC44,.7SQ
|
DIP40,.6
|
Package Shape |
SQUARE
|
RECTANGULAR
|
Package Style |
CHIP CARRIER
|
IN-LINE
|
Parallel/Serial |
PARALLEL
|
PARALLEL
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
4.57 mm
|
|
Standby Current-Max |
0.00006 A
|
0.0001 A
|
Supply Current-Max |
0.03 mA
|
0.035 mA
|
Supply Voltage-Max (Vsup) |
3.465 V
|
5.5 V
|
Supply Voltage-Min (Vsup) |
3.135 V
|
4.5 V
|
Supply Voltage-Nom (Vsup) |
3.3 V
|
5 V
|
Surface Mount |
YES
|
NO
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
COMMERCIAL
|
AUTOMOTIVE
|
Terminal Finish |
MATTE TIN
|
MATTE TIN
|
Terminal Form |
J BEND
|
THROUGH-HOLE
|
Terminal Pitch |
1.27 mm
|
2.54 mm
|
Terminal Position |
QUAD
|
DUAL
|
Width |
16.586 mm
|
15.24 mm
|
Base Number Matches |
1
|
1
|
|
|
|
Compare M27V160-150XK1TR with alternatives
Compare M27C1024-55B3 with alternatives