M27C1024-55B3 vs M27C1024-80XC6TR feature comparison

M27C1024-55B3 STMicroelectronics

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M27C1024-80XC6TR STMicroelectronics

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Rohs Code Yes Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer STMICROELECTRONICS STMICROELECTRONICS
Part Package Code DIP LCC
Package Description DIP, DIP40,.6 QCCJ, LDCC44,.7SQ
Pin Count 40 44
Reach Compliance Code compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.71 8542.32.00.71
Access Time-Max 55 ns 80 ns
I/O Type COMMON COMMON
JESD-30 Code R-PDIP-T40 S-PQCC-J44
JESD-609 Code e3 e3
Length 52.18 mm 16.5862 mm
Memory Density 1048576 bit 1048576 bit
Memory IC Type OTP ROM OTP ROM
Memory Width 16 16
Number of Functions 1 1
Number of Terminals 40 44
Number of Words 65536 words 65536 words
Number of Words Code 64000 64000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Organization 64KX16 64KX16
Output Characteristics 3-STATE 3-STATE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP QCCJ
Package Equivalence Code DIP40,.6 LDCC44,.7SQ
Package Shape RECTANGULAR SQUARE
Package Style IN-LINE CHIP CARRIER
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Standby Current-Max 0.0001 A 0.0001 A
Supply Current-Max 0.035 mA 0.035 mA
Supply Voltage-Max (Vsup) 5.5 V 5.25 V
Supply Voltage-Min (Vsup) 4.5 V 4.75 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO YES
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE INDUSTRIAL
Terminal Finish MATTE TIN MATTE TIN
Terminal Form THROUGH-HOLE J BEND
Terminal Pitch 2.54 mm 1.27 mm
Terminal Position DUAL QUAD
Width 15.24 mm 16.5862 mm
Base Number Matches 1 1
Seated Height-Max 4.7 mm

Compare M27C1024-55B3 with alternatives

Compare M27C1024-80XC6TR with alternatives