M27C801-80N6XTR vs KM23V8000BG-20 feature comparison

M27C801-80N6XTR STMicroelectronics

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KM23V8000BG-20 Samsung Semiconductor

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Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer STMICROELECTRONICS SAMSUNG SEMICONDUCTOR INC
Reach Compliance Code not_compliant unknown
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.71 8542.32.00.71
Access Time-Max 35 ns 200 ns
I/O Type COMMON
JESD-30 Code R-PDSO-G32 R-PDSO-G32
JESD-609 Code e0 e0
Memory Density 65536 bit 8388608 bit
Memory IC Type OTP ROM MASK ROM
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 32 32
Number of Words 1048576 words 1048576 words
Number of Words Code 8000 1000000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 85 °C 70 °C
Operating Temperature-Min -40 °C
Organization 8KX8 1MX8
Output Characteristics 3-STATE 3-STATE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TSSOP SOP
Package Equivalence Code TSSOP32,.8,20 SOP32,.56
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE
Parallel/Serial PARALLEL PARALLEL
Standby Current-Max 0.0001 A 0.00005 A
Supply Current-Max 0.001 mA 0.03 mA
Supply Voltage-Max (Vsup) 5.5 V 3.6 V
Supply Voltage-Min (Vsup) 4.5 V 2.7 V
Supply Voltage-Nom (Vsup) 5 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL COMMERCIAL
Terminal Finish TIN LEAD TIN LEAD
Terminal Form GULL WING GULL WING
Terminal Pitch 0.5 mm 1.27 mm
Terminal Position DUAL DUAL
Base Number Matches 1 1
Pbfree Code No
Part Package Code SOIC
Package Description SOP, SOP32,.56
Pin Count 32
Length 20.47 mm
Qualification Status Not Qualified
Seated Height-Max 3 mm
Width 11.43 mm

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Compare KM23V8000BG-20 with alternatives