M27C256B-90XB7
vs
M87C257-90X3X
feature comparison
All Stats
Differences Only
Pbfree Code
No
Rohs Code
No
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
STMICROELECTRONICS
STMICROELECTRONICS
Package Description
DIP, DIP28,.6
QCCJ,
Reach Compliance Code
not_compliant
unknown
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.71
8542.32.00.71
Access Time-Max
90 ns
55 ns
I/O Type
COMMON
JESD-30 Code
R-PDIP-T28
R-PQCC-J32
JESD-609 Code
e0
Memory Density
67108864 bit
65536 bit
Memory IC Type
OTP ROM
OTP ROM
Memory Width
8
8
Number of Functions
1
1
Number of Terminals
28
32
Number of Words
32768 words
32768 words
Number of Words Code
8000000
8000
Operating Mode
SYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
105 °C
125 °C
Operating Temperature-Min
-40 °C
-40 °C
Organization
8MX8
8KX8
Output Characteristics
3-STATE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
DIP
QCCJ
Package Equivalence Code
DIP28,.6
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
CHIP CARRIER
Parallel/Serial
PARALLEL
PARALLEL
Programming Voltage
12.75 V
Qualification Status
Not Qualified
Not Qualified
Standby Current-Max
0.0001 A
Supply Current-Max
0.03 mA
0.03 mA
Supply Voltage-Max (Vsup)
3.6 V
3.6 V
Supply Voltage-Min (Vsup)
3 V
3 V
Supply Voltage-Nom (Vsup)
3.3 V
3.3 V
Surface Mount
NO
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
AUTOMOTIVE
Terminal Finish
TIN LEAD
Terminal Form
THROUGH-HOLE
J BEND
Terminal Pitch
2.54 mm
Terminal Position
DUAL
QUAD
Base Number Matches
1
1
Compare M27C256B-90XB7 with alternatives
Compare M87C257-90X3X with alternatives