M27C160-70XS1
vs
KM23C16000C-10
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
STMICROELECTRONICS
SAMSUNG SEMICONDUCTOR INC
Part Package Code
DIP
DIP
Package Description
0.600 INCH, PLASTIC, SDIP-42
DIP, DIP42,.6
Pin Count
42
42
Reach Compliance Code
not_compliant
unknown
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.71
8542.32.00.71
Access Time-Max
70 ns
100 ns
Alternate Memory Width
8
8
I/O Type
COMMON
JESD-30 Code
R-PDIP-T42
R-PDIP-T42
JESD-609 Code
e0
e0
Length
36.83 mm
52.42 mm
Memory Density
16777216 bit
16777216 bit
Memory IC Type
OTP ROM
MASK ROM
Memory Width
16
8
Number of Functions
1
1
Number of Terminals
42
42
Number of Words
1048576 words
2097152 words
Number of Words Code
1000000
2000000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Organization
1MX16
2MX8
Output Characteristics
3-STATE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
SDIP
DIP
Package Equivalence Code
SDIP42,.6
DIP42,.6
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE, SHRINK PITCH
IN-LINE
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
5.08 mm
5.08 mm
Standby Current-Max
0.0001 A
0.00005 A
Supply Current-Max
0.07 mA
0.05 mA
Supply Voltage-Max (Vsup)
5.25 V
5.5 V
Supply Voltage-Min (Vsup)
4.75 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Finish
TIN LEAD
TIN LEAD
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
1.778 mm
2.54 mm
Terminal Position
DUAL
DUAL
Width
15.24 mm
15.24 mm
Base Number Matches
1
1
Additional Feature
CONFIGURABLE AS 1M X 16
Compare M27C160-70XS1 with alternatives
Compare KM23C16000C-10 with alternatives