M27C1024-80N3
vs
NM27C210NE150
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
STMICROELECTRONICS
NATIONAL SEMICONDUCTOR CORP
Part Package Code
TSOP
DIP
Package Description
10 X 14 MM, PLASTIC, TSOP-40
DIP,
Pin Count
40
40
Reach Compliance Code
not_compliant
unknown
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.71
8542.32.00.71
Access Time-Max
80 ns
150 ns
I/O Type
COMMON
JESD-30 Code
R-PDSO-G40
R-PDIP-T40
JESD-609 Code
e0
Length
12.4 mm
52.235 mm
Memory Density
1048576 bit
1048576 bit
Memory IC Type
OTP ROM
OTP ROM
Memory Width
16
16
Number of Functions
1
1
Number of Terminals
40
40
Number of Words
65536 words
65536 words
Number of Words Code
64000
64000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
125 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Organization
64KX16
64KX16
Output Characteristics
3-STATE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TSOP1
DIP
Package Equivalence Code
TSSOP40,.56,20
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE, THIN PROFILE
IN-LINE
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.2 mm
5.334 mm
Standby Current-Max
0.0001 A
Supply Current-Max
0.035 mA
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
NO
Technology
CMOS
CMOS
Temperature Grade
AUTOMOTIVE
INDUSTRIAL
Terminal Finish
TIN LEAD
Terminal Form
GULL WING
THROUGH-HOLE
Terminal Pitch
0.5 mm
2.54 mm
Terminal Position
DUAL
DUAL
Width
10 mm
15.24 mm
Base Number Matches
1
2
Compare M27C1024-80N3 with alternatives
Compare NM27C210NE150 with alternatives