M27C1024-80N3 vs NM27C210NE150 feature comparison

M27C1024-80N3 STMicroelectronics

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NM27C210NE150 Texas Instruments

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Rohs Code No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer STMICROELECTRONICS NATIONAL SEMICONDUCTOR CORP
Part Package Code TSOP DIP
Package Description 10 X 14 MM, PLASTIC, TSOP-40 DIP,
Pin Count 40 40
Reach Compliance Code not_compliant unknown
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.71 8542.32.00.71
Access Time-Max 80 ns 150 ns
I/O Type COMMON
JESD-30 Code R-PDSO-G40 R-PDIP-T40
JESD-609 Code e0
Length 12.4 mm 52.235 mm
Memory Density 1048576 bit 1048576 bit
Memory IC Type OTP ROM OTP ROM
Memory Width 16 16
Number of Functions 1 1
Number of Terminals 40 40
Number of Words 65536 words 65536 words
Number of Words Code 64000 64000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Organization 64KX16 64KX16
Output Characteristics 3-STATE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TSOP1 DIP
Package Equivalence Code TSSOP40,.56,20
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE IN-LINE
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.2 mm 5.334 mm
Standby Current-Max 0.0001 A
Supply Current-Max 0.035 mA
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES NO
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE INDUSTRIAL
Terminal Finish TIN LEAD
Terminal Form GULL WING THROUGH-HOLE
Terminal Pitch 0.5 mm 2.54 mm
Terminal Position DUAL DUAL
Width 10 mm 15.24 mm
Base Number Matches 1 2

Compare M27C1024-80N3 with alternatives

Compare NM27C210NE150 with alternatives